Stacked-die including a die in a package substrate

ABSTRACT

Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include a substrate, a first die, and a second die coupled to the first die and the substrate. The substrate may include an opening. At least a portion of the die may occupy at least a portion of the opening in the substrate. Other embodiments including additional apparatuses and methods are described.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.13/629,368, filed Sep. 27, 2012, which is incorporated by referenceherein in its entirety.

TECHNICAL FIELD

Embodiments pertain to semiconductor device packaging. Some embodimentsrelate to stacked-die packages.

BACKGROUND

Many electronic items, such as cellular phones, tablets, and computers,usually have a semiconductor die enclosed in an integrated circuit (IC)package. The die often has circuitry that may form a device, such as amemory device to store information or a processor to processinformation. The device in the die may generate heat when it operates.Thus, a thermal solution such as a heat sink is typically included inthe IC package to cool the die.

Some conventional IC packages may have multiple dice in order toincrease memory storage capacity, processing capability, or both. Tosave area in some IC packages, the multiple dice may be stacked on topof each other. Stacked-die, however, may increase the overall thicknessof the IC package, causing it to be unsuitable for use in someelectronic items. Further, providing adequate thermal solutions for someIC packages to cool the stacked-die may pose a challenge.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross section of an apparatus in the form of electronicequipment including a package coupled to a base, according to someembodiments described herein.

FIG. 2 shows dice after they are disassembled from the package of FIG.1, according to some embodiments described herein.

FIG. 3 shows a substrate after it is disassembled from the package ofFIG. 1, according to some embodiments described herein.

FIG. 4 shows a base after it is disassembled from the package of FIG. 1,according to some embodiments described herein.

FIG. 5 shows a cross section of an apparatus in the form of electronicequipment including a heat dissipating device, according to someembodiments described herein.

FIG. 6 shows a cross section of an apparatus in the form of electronicequipment, which may be a variation of the electronic equipment of FIG.1, according to some embodiments described herein.

FIG. 7 shows a cross section of an apparatus in the form of electronicequipment of FIG. 6 including a heat dissipating device, according tosome embodiments described herein.

FIG. 8 shows a cross section of an apparatus in the form of electronicequipment, which may be a variation of electrical equipment of FIG. 6,according to some embodiments described herein.

FIG. 9 shows a cross section of an apparatus in the form of electronicequipment of FIG. 8 including a heat dissipating device, according tosome embodiments described herein.

FIG. 10 shows a cross section of an apparatus in the form of electronicequipment including a package coupled to a base having no openings,according to some embodiments described herein.

FIG. 11 shows a base after it is disassembled from the package of FIG.10, according to some embodiments described herein.

FIG. 12 shows a cross section of an apparatus in the form of electronicequipment including a package having a structure coupled to a die,according to some embodiments described herein.

FIG. 13 through FIG. 19 show methods of forming electronic equipments,according to some embodiments described herein.

DETAILED DESCRIPTION

FIG. 1 shows a cross section of an apparatus in the form of electronicequipment 100 including a package 101 coupled to a base 190, accordingto some embodiments described herein. Electronic equipment 100 mayinclude or be included in electronic items such as cellular telephones,smart phones, tablets, e-readers (e.g., e-book readers), laptops,desktops, personal computers, servers, personal digital assistants(PDAs), web appliances, set-top boxes (STBs), network routers, networkswitches, network bridges, other types of devices or equipments.

Package 101 in FIG. 1 may include a ball grid array (BGA) type packageor another type of package. Base 190 may include a circuit board, suchas a printed circuit board (PCB). Package 101 may include a die 110, adie 120, a substrate 130, a heat dissipating device 140, and a thermalinterface material (TIM) 145. Die 110 may be stacked over die 120 toform a stacked-die. Die 110 and 120 may be coupled to each other byelectrical connections 151. Die 120 may be coupled to substrate 130 byelectrical connections 152. Substrate 130 may be coupled to base 190 byelectrical connections 153. Package 101 may include material 161 betweendie 110 and die 120 and material 162 between die 120 and substrate 130.

Electrical connections 151, 152, and 153 may include electricallyconductive materials, such as solder or other electrically conductivematerials. For example, electrical connections 151 and 152 may includeSn—Cu solder paste, Sn—Ag solder paste, Sn—Ag—Cu solder paste (e.g. SAC305). Electrical connections 153 may include Sn—Ag—Cu solder paste (e.g.SAC 405, SAC 305). Materials 161 and 162 may include electricallynon-conductive materials (e.g., underfill materials) such as epoxy orother electrically non-conductive materials. Heat dissipating device 140may include metals (e.g., copper) or other materials. TIM 145 mayinclude heat conducting material. Example materials for TIM 145 includepolymer TIM, silver-filled epoxy, phase change material, thermal grease,indium solder, and other materials.

Substrate 130 may include an organic substrate, ceramic substrate, oranother type of substrate. Substrate 130 may include a package substrate(e.g., a substrate in a BGA package). Substrate 130 may include internalconductive paths such as conductive paths 156 and 157, to allowelectrical communication among components, such as among components 198and 199 (coupled to base 190) and die 110 and die 120.

Substrate 130 includes a side (e.g., surface) 131 and a side (e.g.,surface) 132 opposite from side 131. Substrate 130 may include anopening (e.g., a hole) 133. Conductive paths 156 and 157 may includevias filled with conductive materials (e.g., metals) that may bepartially formed in substrate 130. As shown in FIG. 1, substrate 130 mayinclude no conductive paths (e.g., no electrical vias) extending fromside 131 to side 132 of substrate 130. Substrate 130 may include noactive components (e.g., transistors).

Each of die 110 and 120 may include a semiconductor (e.g., silicon) die.Each of die 110 and die 120 may include circuitry (not shown in FIG. 1)that may form part of a device (or devices) to perform one or morefunctions, such as storing information, processing information, or otherfunctions. For example, die 110 may include a memory device (e.g.,including transistors, memory cells, and other components) to storeinformation. The memory device may include a flash memory device, adynamic random access memory (DRAM) device, a static random accessmemory (SRAM), or another type of memory device. In another example, die120 may include a processor (e.g., including transistors, arithmeticlogic units, and other components) that may include a central processunit (CPU), a graphics processing unit (GPU), or both. The processor mayalso include application specific integrated circuits (ASIC).

Die 110 and die 120 may include other combinations of devices. Forexample, die 110 may include a processor and die 120 may include amemory device. In another example, both die 110 and 120 may includeeither all processors or all memory devices.

As shown in FIG. 1, die 110 includes a side (e.g., surface) 111 and aside (e.g., surface) 112 opposite from side 111. Side 111 may be anactive side of die 110 where electrical connections (e.g., electricalconnections 151) are located. Side 112 may be a backside of die 110where no electrical connections are located. Die 120 includes a side(e.g., surface) 121 and a side (e.g., surface) 122 opposite from side121. Side 121 may be an active side of die 120 where electricalconnections (e.g., 151) are located. Side 122 may be a backside of die120 where no electrical connections are located.

Die 110 and 120 may be directly coupled (e.g., directly bonded) to eachother in a face-to-face fashion, such that side 111 (e.g., active side)of die 110 and side 121 (e.g., active side) of die 120 may directly faceeach other. Electrical connections 151 may be directly coupled to die110 and directly coupled to die 120, such that electrical connections151 may be located directly between side 111 of die 110 and side 121 ofdie 120 and may directly contact sides 111 and 121. Electricalconnections 152 may be directly coupled to die 120 and directly coupledto substrate 130, such that electrical connections 152 may be locateddirectly between side 121 of die 120 and a side 131 of substrate 130 maydirectly contact sides 121 and 131. Electrical connections 151 (couplingdie 120 to die 110) and electrical connections 152 (coupling die 120 tosubstrate 130) may be on the same side (e.g., side 121) of die 120.Electrical connections 152 (coupling substrate 130 to die 120) andelectrical connections 153 (coupling substrate 130 to base 190) may beon the same side (e.g., side 131) of substrate 130.

As shown in FIG. 1, at least a portion of die 110 may be located inside(e.g., partially or completely embedded in) opening 133, such that atleast a portion of die 110 may occupy at least a portion of opening 133.At least a portion of a die (e.g., die 110) refers to either only aportion of the die (e.g., only a portion of die 110) or the entire die(e.g., the entire die 110).

Die 120 may include no portions located inside opening 133 (e.g., theentire die 120 is outside opening 133). Therefore, no portions of die120 may occupy any portion of opening 133.

Heat dissipating device 140 may be arranged to dissipate heat frompackage 101, such as to dissipate heat from die 110 or both of die 110and die 120. Heat dissipating device 140 may include a heat spreader(e.g., an integrated heat spreader) or another type of thermal solution.Heat dissipating device 140 may be directly coupled to side 112 (e.g.,backside) of die 110 by TIM 145. TIM 145 may enhance heat conduction(e.g., from die 110 to heat dissipating device 140) to further improve(e.g., increase) heat dissipation from die 110.

Heat dissipating device 140 may also be arranged to serve as a stiffenerto improve the structure of package 101 (e.g., improve the stricture ofsubstrate 130). For example, as shown in FIG. 1, heat dissipating device140 may be coupled (e.g., directly coupled) to side 132 of substrate130. In some situations, such as when substrate 130 includes thin coresubstrate, a coreless substrate, or other relatively thin substrate,heat dissipating device 140 (as arranged in FIG. 1) may prevent (orreduce) warpage that may occur to substrate 130.

Base 190 includes a side (e.g., surface) 191 and a side (e.g., surface)192 opposite from side 191. Base 190 may include components (e.g.,components 198 and 199) such as capacitors, resistors, transistors,integrated circuit chips, or other electrical components coupled to itor formed thereon. FIG. 1 shows an example where components 198 and 199are located on only one side (e.g., side 191) of base 190. Components198 and 199, however, may be located on both sides (e.g., sides 191 and192) of base 190. Base 190 may include an opening (e.g., a hole) 193.

Die 110 and die 120 may communicate (e.g., electrically communicate)with each other through electrical connections 151. Electricalconnections 151 may carry information (e.g., in the form of electricalsignals) communicated between the die 110 and die 120. The informationmay include data information, control information, power and ground, orother information. Die 110 may include no electrical conductive paths(e.g., through silicon vias (TSVs)) between sides 111 and 112. Thus,electrical communication to and from die 110 (e.g., between die 110 anddie 120) may be carried through electrical connections (e.g., electricalconnections 151) on only side 111 of die 110.

Die 120 and substrate 130 may communicate (e.g., electricallycommunicate) with each other through electrical connections 152.Electrical connections 152 may carry information (e.g., in the form ofelectrical signals) communicated between the die 120 and substrate 130.Die 120 may include no electrical conductive paths (e.g., TSVs) betweensides 121 and 122. Thus, electrical communication to and from die 120(e.g., between die 120 and die 110 and between die 120 and substrate130) may be carried through electrical connections (e.g., electricalconnections 151 and 152) on only side 121 of die 120.

Die 110 and die 120 may communicate (e.g., electrically communicate)with other components (e.g., components 198 and 199 coupled to base 190)through electrical connections 151, 152, and 153. For example, die 110and die 120 may communicate with component 198 through one or more paths(e.g., signal paths) that may include electrical connections 151,conductive path 154, electrical connections 152, conductive path 156,electrical connections 153, and conductive path 158. In another example,die 110 and die 120 may communicate with a component 199 on base 190through one or more paths (e.g., signal paths) that may includeelectrical connections 151, conductive path 155, electrical connections152, conductive path 157, electrical connections 153, and conductivepath 159.

FIG. 2 shows die 110 and 120 after they are disassembled from package101 of FIG. 1. Lines 1-1 in FIG. 2 indicates locations of the crosssections of die 110 and 120 in FIG. 1. As shown in FIG. 2, die 110 mayhave a size (e.g., total surface area on side 111) less than the size(e.g., total surface area on side 121) of die 120. Die 110 includes alength 114. Die 120 includes a length 124, which may be greater thanlength 114 of die 110. A portion of electrical connections 151 may be onside 111 of die 110, and another portion of electrical connections 151may be on side 121 of die 120. A portion of electrical connections 152may also be on side 121 of die 120.

FIG. 3 shows substrate 130 after it is disassembled from package 101 ofFIG. 1. Line 1-1 in FIG. 3 indicates a location of the cross section ofsubstrate 130 in FIG. 1. Opening 133 of substrate 130 includes a length134, which may be greater than length 114 (FIG. 2) of die 110. As shownin FIG. 3, opening 133 may be part of a hole in a portion of substrate130. A portion of electrical connections 152 and a portion of electricalconnections 153 may be on side 131 of substrate 130.

FIG. 4 shows base 190 after it is disassembled from package 101 ofFIG. 1. Line 1-1 in FIG. 4 indicates the location of the cross sectionof base 190 in FIG. 1. Opening 193 of base 190 includes a length 194,which may be greater than length 124 (FIG. 2) of die 120. As shown inFIG. 4, opening 193 may be part of a hole in a portion of base 190. Aportion of electrical connections 153 may be on side 191 of base 190.

As shown in FIG. 1 and FIG. 3, including an opening (e.g., opening 133)in substrate 130 may allow for more options in the selection of thestructure of die 110, die 120, or both of package 101. For example, withopening 133 in substrate 130, die 110, die 120 or both may be selectedto be either a thin die (e.g., 50 nanometers (nm) or less in thickness)or a thick die (e.g., greater than 50 nm in thickness). Package 101 mayallow a thick die to be included in it without impacting the profile(e.g., overall thickness) of package 101 because at least a portion ofthe die (e.g., die 110) may be inside opening 133 of substrate 130. Thismay improve (e.g., reduce) the profile of package 101 and may alsoimprove (e.g., reduce) the overall thickness of electronic equipment100. If a thick die (instead of a thin die) is included in package 101,cost may also be improved (e.g., reduced) because cost associated with athick die may generally be lower than the cost associated with a thindie.

Including an opening (e.g., opening 193) in base 190 (FIG. 1 and FIG. 4)may further improve the profile (e.g., overall thickness) of electricalequipment 100. For example, with opening 193 in base 190, a die (e.g.,die 120) of package 101 may also be a thick die without impacting theprofile of electrical equipment 100 because at least a portion of thedie (e.g., die 120) may be inside opening 193 of base 190.

Including an opening (e.g., opening 193) in base 190 may also allow formore options in the selection of additional types of thermal solution(besides heat dissipating device 140) for package 101, as described inmore detail with reference to FIG. 5.

FIG. 5 shows a cross section of an apparatus in the form of electronicequipment 500 including a heat dissipating device 540, according to someembodiments described herein. Electronic equipment 500 may includeelements similar to or identical to those of electronic equipment 100(FIG. 1). Thus, for simplicity, the description of similar or identicalelements between FIG. 1 and FIG. 5 is not repeated in the descriptionFIG. 5. Differences between electronic equipment 100 (FIG. 1) andelectronic equipment 500 (FIG. 5) include heat dissipating device 540and TIM 545 in electronic equipment 500.

Heat dissipating device 540 may be arranged to dissipate heat frompackage 101, such as to dissipate heat from die 120 or both of die 110and die 120. Heat dissipating device 540 may include a heat spreader(e.g., an integrated heat spreader) or another type of thermal solution.As shown in FIG. 5, heat dissipating device 540 may be directly coupledto side 122 of die 120 by a thermal interface material (TIM) 545. TIM545 may enhance heat conduction (e.g., from die 120 to heat dissipatingdevice 540) to further improve (e.g., increase) heat dissipation fromdie 120.

Besides heat dissipating device 140 (e.g., on top of package 101), heatdissipating device 540 (at the bottom of package 101) may furtherimprove thermal solutions for package 101. For example, in somesituations, hot spots may occur in die 120 (e.g., at the bottom portionnear side 122 of die 120) if heat dissipating device 540 is not includedpackage 101. Coupling heat dissipating device 540 to die 120 as shown inFIG. 5 may eliminate or reduce such hot spots. This may further improvethermal solutions in package 101.

FIG. 6 shows a cross section of an apparatus in the form of electronicequipment 600, which may be a variation of electronic equipment 100 ofFIG. 1, according to some embodiments described herein. Electronicequipment 600 may include elements similar to or identical to those ofelectronic equipment 100 (FIG. 1). Thus, for simplicity, the descriptionof similar or identical elements between FIG. 1 and FIG. 6 is notrepeated in the description FIG. 6. Differences between electronicequipment 100 (FIG. 1) and electronic equipment 600 (FIG. 6) include thearrangement of die 120 and opening 193 of base 190. As shown in FIG. 6,die 120 may include no portions located inside opening 193 of substrate130 (e.g., the entire die 120 is outside opening 193). Thus, no portionsof die 120 may occupy any portion of opening 193 of substrate 130.

FIG. 7 shows a cross section of an apparatus in the form of electronicequipment 700 including a heat dissipating device 740, according to someembodiments described herein. Electronic equipment 700 may includeelements similar to or identical to those of electronic equipment 600(FIG. 6). Thus, for simplicity, the description of similar or identicalelements between FIG. 6 and FIG. 7 is not repeated in the descriptionFIG. 7. Differences between electronic equipment 600 (FIG. 6) andelectronic equipment 700 (FIG. 7) include the addition of heatdissipating device 740 and TIM 745 in electronic equipment 700. Heatdissipating device 740 may be arranged to dissipate heat from package101, such as to dissipate heat from die 120 or both of die 110 and die120.

FIG. 8 shows a cross section of an apparatus in the form of electronicequipment 800, which may be a variation of electrical equipment 600 ofFIG. 6, according to some embodiments described herein. Electronicequipment 800 may include elements similar to or identical to those ofelectronic equipment 600 (FIG. 6). Thus, for simplicity, the descriptionof similar or identical elements between FIG. 6 and FIG. 8 is notrepeated in the description FIG. 8. Differences between electronicequipment 600 (FIG. 6) and electronic equipment 800 (FIG. 8) includedifferences between a length 894 of opening 893 of base 890 and length124 (FIG. 2) of die 120. Length 894 of opening 893 may be less thanlength 124 of die 120. Thus, as shown in FIG. 5, opening 893 of base 890may directly face only a portion of side 122 of die 120 (e.g., opening893 does not face the entire side 122 of die 120). In FIG. 1, opening193 may directly face the entire side 122 of die 120.

FIG. 9 shows a cross section of an apparatus in the form of electronicequipment 900 including a heat dissipating device 940, according to someembodiments described herein. Electronic equipment 900 may includeelements similar to or identical to those of electronic equipment 800(FIG. 8). Thus, for simplicity, the description of similar or identicalelements between FIG. 8 and FIG. 9 is not repeated in the descriptionFIG. 9. Differences between electronic equipment 800 (FIG. 8) andelectronic equipment 900 (FIG. 9) include the addition of heatdissipating device 940 and TIM 945 in electronic equipment 900. Heatdissipating device 940 may be arranged to dissipate heat from package101, such as to dissipate heat from die 120 or both of die 110 and die120.

FIG. 10 shows a cross section of an apparatus in the form of electronicequipment 1000 including a package 101 coupled to a base 1090 having noopenings, according to some embodiments described herein. Electronicequipment 1000 may include elements similar to or identical to those ofelectronic equipment 100 (FIG. 1). Thus, for simplicity, the descriptionof similar or identical elements between FIG. 1 and FIG. 10 is notrepeated in the description FIG. 10. Differences between electronicequipment 100 (FIG. 1) and electronic equipment 1000 (FIG. 10) includedifferences in base 190 (FIG. 1) and base 1090 (FIG. 10). As shown inFIG. 10, base 1090 may include no opening facing die 120. Withoutopenings in base 1090, die 120 may include a thin die.

FIG. 11 shows base 1090 of FIG. 10 after it is disassembled from package101 (FIG. 10). Line 10-10 in FIG. 11 indicates a location of the crosssection of base 1090 in FIG. 10. As shown in FIG. 11, base 1090 mayinclude no opening at portion 1196 that faces die 120 (FIG. 10).

In the above description with respect to FIG. 1 through FIG. 11, each ofelectronic equipments 100, 500, 600, 700, 800, 900, and 1000 may includea top die (e.g., die 110) coupled to a bottom die (e.g., die 120).However, in some arrangements, the bottom die (e.g., die 120) may bereplaced by a structure different from a die (e.g., a structure thatdoes not include a die). For example, in some arrangements, aninterposer may replace die 120.

FIG. 12 shows a cross section of an apparatus in the form of electronicequipment 1200 including a package 101 having a structure 1220 coupledto die 110, according to some embodiments described herein. Electronicequipment 1200 may include elements similar to or identical to those ofelectronic equipment 100 (FIG. 1). Thus, for simplicity, the descriptionof similar or identical elements between FIG. 1 and FIG. 12 is notrepeated in the description FIG. 12.

As shown in FIG. 12, structure 1220 includes a side 1221 and a side 1222opposite from side 1221. Structure 1220 may include an interposer oranother type of structure having conductive paths to providecommunication between die 110 to other components (e.g., components 198and 199). Structure 1220 may include components 1225 (e.g., passivecomponents) such as capacitors, inductors, resistors, and other passivecomponents. Structure 1220 may include no active components, such astransistors. FIG. 12 shows components 1225 being located on side 1222 ofstructure 1220 as an example. However, some or all of components 1225may be inside structure 1220. In an alternative arrangement, structure1220 may be replaced by a die (or alternatively may include a die), suchas die 120 described above with reference to FIG. 1 through FIG. 11.

FIG. 13 through FIG. 19 show methods of forming electronic equipments,according to some embodiments described herein. The electronicequipments formed by the methods described below with reference to FIG.13 through FIG. 19 may include the electronic equipments (e.g., 100,500, 600, 700, 800, 900, 1000, and 1200) described above with referenceto FIG. 1 through FIG. 12.

As shown in FIG. 13, method 1305 may include attaching die 1310 to die1320. Die 1310 and die 1320 may correspond to die 110 and die 120,respectively, of FIG. 1 through FIG. 11. Alternatively, die 1320 in FIG.13 may be replaced by a structure, such as structure 1220 of FIG. 12. InFIG. 13, die 1310 includes a side 1311 (e.g., active side) and side a1312 (e.g., backside) opposite from side 1311. Sides 1311 and 1312 mayinclude an active side and a backside, respectively, of die 1310. Die1320 includes a side (e.g., surface) 1321 and a side (e.g., surface)1322 opposite from side 1321. Sides 1321 and 1322 may include an activeside and a backside, respectively, of die 1320. Side 1311 of die 1310may include electrical connections (e.g., solder balls, solder bumps, oranother type of conductive connection) 1351 formed thereon. Although notshown in FIG. 13, side 1321 of die 1320 may include electricalconnections (e.g., conductive pads) formed thereon and to be bonded toelectrical connections 1351 of die 1310. Die 1310 and die 1320 may beattached to each other (e.g., by flip chip technique), such thatelectrical connections 1351 of die 1310 may be bonded to correspondingelectrical connections of die 1320 and form a controlled collapse chipconnection (C4).

In FIG. 13, attaching die 1310 to die 1320 in method 1305 may includearranging die 1310 and 1320 in face-to-face position, such that side1311 of die 1310 may directly face side 1321 of die 1320. Attaching die1310 to die 1320 may also include positioning (e.g., aligning)electrical connections 1351 of die 1310 in direct contact withcorresponding electrical connections on side 1321 of die 1320. Then, areflow process (e.g., reflow soldering process) may be performed to bondelectrical connections 1351 of die 1310 to corresponding electricalconnections of die 1320.

FIG. 14 shows a combination (e.g., stacked-die) including die 1310 and1320 after they have been attached (e.g., bonded) to each other.Electrical connections 1351 between die 1310 and die 1320 may correspondto electrical connections 151 (e.g., FIG. 1). As shown in FIG. 14,material (e.g., underfill material) 1461 may be formed between die 1310and die 1320 and around electrical connections 1351.

FIG. 15 shows a method 1505 of attaching the combination of die 1310 anddie 1320 to an assembly 1502, according to some embodiments describedherein. The combination of die 1310 and die 1320 of FIG. 14 may beflipped over (as shown in FIG. 15) before attaching to assembly 1502.Assembly 1502 may include components such as a substrate 1530 coupled toa heat dissipating device 1540 and a TIM 1545. These components may bepre-attached before assembly 1502 is attached to the combination of die1310 and die 1320. Substrate 1530 of assembly 1502 includes a side(e.g., surface) 1531 and a side (e.g., surface) 1532 opposite from side1531. Side 1531 may include electrical connections (e.g., solder balls,solder bumps, or another type of conductive connection) 1552 formedthereon. Substrate 1530 may include an opening 1533. Substrate 1530 maycorrespond to substrate 130 (e.g., FIG. 1). Thus, opening 1533 ofsubstrate 1530 may correspond to opening 133 of substrate 130.

In FIG. 15, attaching the combination of die 1310 and die 1320 toassembly 1502 in method 1505 may include positioning (e.g., aligning)die 1310 directly over opening 1533 of substrate 1530, such that afterthe combination of die 1310 and die 1320 is attached to assembly 1502,at least a portion of die 1310 may be located inside opening 1533 ofsubstrate 1530 to occupy at least a portion of opening 1533.

Attaching the combination of die 1310 and die 1320 to assembly 1502 mayalso include positioning (e.g., aligning) electrical connections 1552 ofsubstrate 1530 in direct contact with corresponding electricalconnections (not shown) on side 1321 of die 1320. Then, a reflow process(e.g., reflow soldering process) may be performed to bond electricalconnections 1352 of substrate 1530 to corresponding electricalconnections side 1321 of die 1320 to form a connection (e.g., controlledcollapse chip connection) between die 1320 and substrate 1530.

FIG. 16 shows a package 1601 after the combination of die 1310 and 1320have been attached (e.g., bonded) to assembly 1502 (FIG. 15). As shownin FIG. 16, material (e.g., underfill material) 1662 may be formedbetween die 1320 and substrate 1530 and around electrical connections1552.

Package 1601 may correspond to package 101 (e.g., FIG. 1) describedabove with reference to FIG. 1 through FIG. 12. In FIG. 16, electricalconnections 1552 between substrate 1530 and die 1320 may correspond toelectrical connections 152 (e.g., FIG. 1). As shown in FIG. 16, package1601 may include electrical connections 1653 formed on side 1531 ofsubstrate 1530. Electrical connections 1653 may be formed after thecombination of die 1310 and 1320 have been attached to assembly 1502(FIG. 15). Electrical connections 1653 may include solder balls oranother type of conductive connection. Electrical connections 1653 mayenable package 1601 to be electrically coupled to other components(e.g., to a circuit board (e.g., PCB) of electronic equipment.

FIG. 17 shows a method 1705 of attaching package 1601 of FIG. 16 to abase 1790, according to some embodiments described herein. Package 1601of FIG. 16 may be flipped over (as shown in FIG. 17) before attaching tobase 1790 (e.g., by surface mounting technique). As shown in FIG. 17,base 1790 includes a side (e.g., surface) 1791 and side (e.g., surface)1792 opposite from side 1791. Base 1790 may include an opening 1793.Base 1790 may correspond to base 190 (e.g., FIG. 1 and FIG. 4). Thus,opening 1793 of base 1790 may be similar to or identical to opening 193of base 190.

In FIG. 17, attaching package 1601 to base 1790 in method 1705 mayinclude positioning (e.g., aligning) die 1320 directly over opening 1793of base 1790, such that after package 1601 is attached to base 1790, atleast a portion of die 1320 may be located inside opening 1793 of base1790 to occupy at least a portion of opening 1793.

Attaching package 1601 to base 1790 in method 1705 may also includepositioning (e.g., aligning) electrical connections 1653 of substrate1530 in direct contact with corresponding electrical connections (notshown) on side 1791 of base 1790. Then, a reflow process (e.g., reflowsoldering process) may be performed to bond electrical connections 1653of substrate 1530 to corresponding electrical connections on side 1791of base 1790.

FIG. 18 shows package 1601 after it has been attached (e.g., bonded) tobase 1790. Electrical connections 1653 between substrate 1530 and base1790 may correspond to electrical connections 153 (e.g., FIG. 1).

The above description with respect to method 1705 of FIG. 17 and FIG. 18shows an example where method 1705 may attach package 1601 to base 1790such that at least a portion of die 1320 may be located inside opening1793 of base 1790 (FIG. 18). In an alternative method, package 1601 maybe attached to base 1790 such that no portions of die 1320 may occupyany portion of opening 1793 (e.g., the entire die 1320 is outsideopening 1793). The arrangement of die 1320 and base 1790 (FIG. 17) insuch an alternative method may be similar to or identical to thearrangement of die 120 and base 190 shown in FIG. 6. In anotheralternative method, opening 1793 (FIG. 17) of base 1790 may have adimension (e.g., a length similar to length 894 in FIG. 8), such thatthe arrangement of die 1320 and base 1790 (FIG. 17) may be similar to oridentical to the arrangement of die 120 and base 890 shown in FIG. 8.

The above description with respect to method 1705 of FIG. 17 and FIG. 18show an example where method 1705 may use a base (e.g., base 1790)having an opening (e.g., opening 1793). In an alternative method, a basewithout an opening may be used. In such an alternative method, thearrangement of die 1320 and the base (without openings) may be similarto or identical to the arrangement of die 120 and base 1090 of FIG. 10.

FIG. 19 shows a method 1905 of attaching a heat dissipating device 1940to die 1320 of package 1601 of FIG. 18, according to some embodimentsdescribed herein. Heat dissipating device 1940 may correspond to heatdissipating device 540 (FIG. 5). In FIG. 19, method 1905 may includeattaching a TIM 1945 to die 1320 such that TIM 1945 is between die 1320and heat dissipating device 1940. TIM 1945 may correspond to TIM 545(FIG. 5).

Method 1905 may use a heat dissipating device and a TIM different fromthose shown in FIG. 19. For example, if the arrangement of die 1320 andbase 1790 is similar to or identical to the arrangement of die 120 andbase 190 of FIG. 6, then method 1905 may use a heat dissipating devicesimilar to identical to heat dissipating device 740 of FIG. 7. Inanother example, if the arrangement of die 1320 and base 1790 in FIG. 19is similar to or identical to the arrangement of die 120 and base 890 ofFIG. 8, then method 1905 may use a heat dissipating device and a TIMsimilar to or identical to heat dissipating device 940 and TIM 945,respectively, of FIG. 9.

The above description and the drawings sufficiently illustrate specificembodiments to enable those skilled in the art to practice them. Otherembodiments may incorporate structural, logical, electrical, process,and other changes. Portions and features of some embodiments may beincluded in, or substituted for, those of other embodiments. Embodimentsset forth in the claims encompass all available equivalents of thoseclaims.

The Abstract is provided to comply with 37 C.F.R. Section 1.72(b)requiring an abstract that will allow the reader to ascertain the natureand gist of the technical disclosure. It is submitted with theunderstanding that it will not be used to limit or interpret the scopeor meaning of the claims. The following claims are hereby incorporatedinto the detailed description, with each claim standing on its own as aseparate embodiment.

What is claimed is:
 1. An apparatus comprising: a substrate including anopening; a first die, a least a portion of the die occupying at least aportion of the opening, and a second die coupled to the first die and tothe substrate.